首页> 外文会议>EPD congress 2004 >THE NUCLEATION AND GROWTH MECHANISM IN TIN ELECTRODEPOSITION
【24h】

THE NUCLEATION AND GROWTH MECHANISM IN TIN ELECTRODEPOSITION

机译:锡电镀中的形核和生长机理

获取原文
获取原文并翻译 | 示例

摘要

Tin electrodeposition from sulfuric acid electrolytes was studied on a glassy carbon substrate by electrochemical techniques. The morphology of tin nuclei and crystallites was observed by scanning electron microscopy (SEM). The analysis of chronoamperomeric experiments revealed that at the nucleation and growth mechanism of tin is dependent on the applied cathodic potential. A transition in the deposition mechanism from 3D progressive to instantaneous nucleation and growth was observed with increasing cathodic potential. The morphology of tin nuclei also varies with applied potentials. At more positive potentials, tetragonal nuclei and crystallites are dominant, and as the potential become more negative, clusters of tin needles increase.
机译:通过电化学技术研究了在玻璃碳基底上硫酸电解液中锡的电沉积。通过扫描电子显微镜(SEM)观察到锡核和微晶的形态。对计时天体的实验分析表明,锡的成核和生长机理取决于所施加的阴极电位。随着阴极电位的增加,观察到了沉积机理从3D进行到瞬时成核和生长的过渡。锡核的形态也随施加的电势而变化。在较高的正电位下,四方晶核和微晶占主导地位,并且随着电位变得越来越负,锡针簇会增加。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号