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Property of Single-Crystalline Si TFTs Fabricated with μ-Czochralski (Grain Filter) Process

机译:μCzochralski(晶粒滤光片)工艺制造的单晶硅TFT的性能

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摘要

Formation of TFTs inside location-controlled large Si grains with a low temperature process is an attractive approach for realizing system-circuit integration with displays on a large glass substrate. Local structural variations of the substrate using photolithography allows an accurate location-control of the large Si grains in excimer-laser crystallization. Single-crystalline Si (c-Si) TFTs was formed inside a location-controlled large (6 μm) grain by μ-Czochraski process of a-Si film. The c-Si TFTs showed field effect mobility of 450 cm~2/Vs on average. Crystallization characteristics, spread of the TFT characteristics and effects of process parameters will be reviewed and discussed.
机译:通过低温工艺在位置受控的大Si晶粒内形成TFT是一种实现与大型玻璃基板上的显示器进行系统电路集成的有吸引力的方法。使用光刻技术对基板进行局部结构变化,可以精确控制准分子激光晶体中大硅晶粒的位置。通过a-Si膜的μ-Czochraski工艺在位置控制的大(6μm)晶粒内形成单晶Si(c-Si)TFT。 c-Si TFT的场效应迁移率平均为450 cm〜2 / Vs。本文将讨论结晶特性,TFT特性的扩展以及工艺参数的影响。

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