DETECTION OF TRIPLE JUNCTION PARAMETERS IN MICROSCOPE IMAGES

摘要

Secondary electron microscope (SEM) images are analyzed in an automatic system to provide material properties for fracture analyses etc. The image processing presently used is summarized and initial results presented. Our new grain boundary (GB) detection and line following algorithms are presented. Line following locates triple junctions (TJs) (points where 3 grains meet). Initial versions of advanced algorithms to calculate TJ angles, reduce false GBs and TJs and select a reduced number of good probe points are advanced using a new noise map. Registration and formation of mosaic images are also addressed.