Effect of Raw Materials on the Thermal Conductivity and Microstructure of Aluminum Nitride

摘要

High thermal conductivity, along with good electrical and mechanical properties, makes aluminum nitride a very promising material for electronic packaging and substrates. Much work has been reported on the influence of additions and sintering aids on densification and thermal conductivity. In this paper, the influence of raw materials on the sintering behavior and thermal conductivity characteristics of pressureless-sintered AlN has been investigated. The highest thermal conductivity is 248W/m.K.