Asynchronous FIFO, Cascade expansion, Simulation waveform

摘要

Assembly precision controlling is difficult in the MEMS solder self-assembly technology, which is influenced by solder model development, model reconstruction and thermal distortion and so on. Thermal distortion of microstructure and solder joint is the key factor which affects the assembly precision greatly. Distortion of microstructure and solder joint induced during the process of soldering is discussed through thermal/structure module in ANSYS in this paper, which includes solder profile setting for MEMS self-assembly experiment, load exerting method, and link position and so on. Distortion of microstructure and solder joint and the comparison under the different condition of link position is emphasized, the methods which can bring in less distortion is obtained, which can provide the self-assembly experimental design with the theory foundation.