首页> 外文会议>ASME international manufacturing science and engineering conference 2011 >MEASUREMENT OF TRANSIENT TOOL INTERNAL TEMPERATURE FIELDS DURING HARD TURNING BY EMBEDDED THIN FILM SENSORS
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MEASUREMENT OF TRANSIENT TOOL INTERNAL TEMPERATURE FIELDS DURING HARD TURNING BY EMBEDDED THIN FILM SENSORS

机译:嵌入式薄膜传感器在硬车削过程中瞬态工具内部温度场的测量

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摘要

This paper presents a novel approach for obtaining thermomechanical data from the close vicinity (i.e., 10s of micrometers) of the tool-workpiece interface while machining hardened steel. Arrays of micro thin film C-type thermocouples with a junction size of 5 μm × 5 μm were fabricated by standard microfabrication methods and have been successfully embedded into polycrystalline cubic boron nitride (PCBN) using a diffusion bonding technique. Scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were performed to examine material interactions at the bonding interface and to determine optimal bonding parameters. Static and dynamic sensor performances have been characterized. The sensors exhibit excellent linearity up to 1300 ℃, fast rise time of 150 ns, and good sensitivity. The PCBN inserts instrumented with embedded thin film C-type thermocouples were successfully applied to measure internal tool temperatures as close as 70 um to the cutting edge while machining hardened steel workpieces at industrially relevant cutting parameters. Acquired temperature data followed theoretical trends very well. Correlations between temperature and cutting parameters have been established. The embedded micro thin film sensor array provided unprecedented temporal and spatial resolution as well as high accuracy for micro-scale transient tool-internal temperature field measurements. Tool internal temperature maps were generated from acquired data. In the frequency domain, obtained thermal data indicated the onset of regenerative machining chatter earlier and more effective than conventional force measurement by dynamometer.
机译:本文提出了一种新颖的方法,用于在加工淬硬钢时从工具-工件界面的近处(即10s微米)获取热机械数据。通过标准的微细加工方法制造了结尺寸为5μm×5μm的微薄膜C型热电偶阵列,并已使用扩散结合技术将其成功嵌入多晶立方氮化硼(PCBN)中。进行了扫描电子显微镜(SEM)和能量色散X射线光谱(EDS),以检查键合界面处的材料相互作用并确定最佳键合参数。静态和动态传感器性能已被表征。该传感器在高达1300℃的温度下具有出色的线性度,150 ns的快速上升时间以及良好的灵敏度。成功地将装有嵌入式C型薄膜热电偶的PCBN刀片用于测量内部刀具温度,该温度接近切削刃70 um,同时以工业相关的切削参数加工硬化的钢工件。采集的温度数据非常符合理论趋势。已经建立了温度和切削参数之间的相关性。嵌入式微薄膜传感器阵列提供了空前的时间和空间分辨率,以及用于微型瞬态工具内部温度场测量的高精度。工具内部温度图是从获取的数据生成的。在频域中,获得的热数据表明再生机械加工颤动的发生比由测功机进行的传统力测量更早,更有效。

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