X-RAY IMAGE ANALYSIS OF DEFECTS AT BGA FOR MANUFACTURING SYSTEM RELIABILITY

摘要

This paper deals with the image analysis of defects at BGA for the reliability in PC boards by using X-ray imaging. To assure the manufacturing reliability, an inspection system of BGA is required in the surface mount process. As we can find mostly solder bridge defects, we pay attention to detecting solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed. To get design data for the development of the inspection system, which can be used easily in the surface mount process, we attempt to measure the shape of BGA based on X-ray imaging.