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OPTIMIZATION OF CHEMICAL ETCHING PROCESS IN NIOBIUM CAVITIES

机译:铌腔化学刻蚀工艺的优化

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摘要

Superconducting niobium cavities are important components of linear accelerators. Buffered chemical polishing (bcp) on the inner surface of the cavity is a standard procedure to improve its performance. The quality of bcp, however, has not been optimized well in terms of the uniformity of surface smoothness. A finite element computational fluid dynamics (cfd) model was developed to simulate the chemical etching process inside the cavity. The analysis confirmed the observation of other researchers that the sections closer to the axis of the cavity received more etching than other regions. A baffle was used by lanl personnel to direct the flow of the etching fluid toward the walls of the cavity. A new baffle design was tined using optimization techniques. The redesigned baffle significantly improves the performance of the etching process. To verify these results an experimental setup for flow visualization was created. The setup consists of a high speed, high resolution ccd camera. The camera is positioned by a computer-controlled traversing mechanism. A dye injecting arrangement is used for tracking the fluid path. Experimental results are in general agreement with computational findings.
机译:超导铌腔是线性加速器的重要组成部分。在型腔内表面进行缓冲化学抛光(bcp)是提高其性能的标准步骤。但是,就表面光滑度的均匀性而言,bcp的质量尚未得到优化。建立了有限元计算流体动力学(cfd)模型来模拟腔体内的化学蚀刻过程。该分析证实了其他研究人员的观察结果,即靠近空腔轴线的部分比其他区域受到的蚀刻更多。维修人员使用挡板将蚀刻液流引向腔壁。使用优化技术对新的挡板设计进行了着色。重新设计的挡板可显着提高蚀刻工艺的性能。为了验证这些结果,创建了用于流量可视化的实验装置。该设置包括一个高速,高分辨率的CCD摄像机。摄像机由计算机控制的移动机构定位。染料注入装置用于跟踪流体路径。实验结果与计算结果基本一致。

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