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Modelling of Crack Bifurcation in Laminar Ceramics with Large Compressive Stress

机译:大压应力层流陶瓷中裂纹分叉的建模

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Ceramic laminates designed with strong interfaces have shown crack growth resistance (R-curve) behaviour through microstructural design (e.g. grain size, layer composition) and/or due to the presence of compressive residual stresses, acting as a barrier to crack propagation. The goal of the contribution is to model the mechanism of crack bifurcation in laminar ceramics with large compressive stress which still have not been satisfactory explained. Experimental observations of the crack path in the multilayered ceramics tested under several kinds of loading showed crack penetration (i.e. crack propagating normal to the layers followed by crack bifurcation when the crack propagated from the tensile to the compressive layer. Numerical results [1] show that the initiation of crack bifurcation can be explained by the near-tip J-integral, provided that micro-cracks exist near the crack tip. We revisit the problem using the concept of Finite fracture mechanics and the matched asymptotic expansion method in order to evaluate the energy release rate criteria describing the competition of the crack bifurcation and straight crack propagation near behind the bimaterial interface.
机译:设计成具有强界面的陶瓷层压板通过微观结构设计(例如晶粒尺寸,层组成)和/或由于存在压缩残余应力而表现出抗裂纹扩展性(R-曲线)行为,所述裂纹残余应力充当裂纹扩展的障碍。贡献的目的是对具有较大压应力的层状陶瓷的裂纹分叉机制进行建模,但仍不能令人满意地解释。在多种载荷下对多层陶瓷的裂纹路径进行的实验观察表明,裂纹的渗透(即裂纹从垂直方向扩展到各层,然后裂纹从拉伸层扩展到压缩层,裂纹分叉,数值结果[1]表明:假设裂纹尖端附近存在微裂纹,可以用近尖端J积分来解释裂纹分叉的发生,我们使用有限断裂力学的概念和匹配的渐近展开法重新研究该问题,以评估裂纹的产生。能量释放速率标准描述了双材料界面附近裂纹分叉和直裂纹扩展的竞争。

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