INVESTIGATION OF HYGRO-THERMAL RESIDUAL STRESSES IN ADHESIVELY BONDED JOINTS

摘要

Coupled 3D finite element analysis has been success-fully used to predict the effect of hygro-thermal residual stresses in lap joints. The effects of moisture on the expansion and the elastic modulus of the adhesive have been taken into account, based on experimental data available. The results show that the stresses due to moisture absorption reduce the state of residual stress caused by cooling from cure. The effect of creep and interfacial moisture transport on the residual stresses and the prediction of joint strength will be considered in future work, as well as applying this method to joints with different adherends.