Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Technical University Berlin, Microperipheric Center;
Technical University Berlin, Microperipheric Center;
Technical University Berlin, Microperipheric Center;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Fraunhofer Institute for Reliability and Microintegration Gustav-Meyer-Allee 25, 13355 Berlin, Germany;
Technical University Berlin, Microperipheric Center;
机译:使用高速封装和PCB中的嵌入式电容器对矩形电力母线的辐射排放进行解析计算
机译:使用多层封装和PCB中的嵌入式薄膜电容器来抑制GHz范围的电源/地感应阻抗并同时产生开关噪声
机译:具有预模制引线框的封装上封装(POP)封装的专利已颁发
机译:大面积模具嵌入式包装套件基于PCB的再分配
机译:基于深入的学习方法,用于检测模塑纸浆包装表面上的异物缺陷
机译:适用于组织嵌入的基于明胶的预制模具与质谱成像兼容
机译:使用可光致图案化的聚酰亚胺超薄芯片封装(UTCp)在柔性pCB中高效嵌入30μm薄芯片