THE ENCAPSULATION OF MEMS/SENSORS AND THE REALIZATION OF MOLDED VIAS ON PACKAGE LEVEL AND WAFER LEVEL WITH FILM ASSISTED MOLDING

摘要

To meet the needs of ambient intelligence and the miniaturization of electronics, a MEMS/sensor package with exposed windows needs access to the environment. This presents a challenge for MEMS or sensor packaging/encapsulation. The exposed die and MEMS/sensor are brittle and can not withstand large stresses. By clamping the film around the chip's functional area, the surface of the chip is protected by film and the MEMS/Sensors exposed window will be bleed and flash free. Relative to steel clamping force, the clamping force when using soft film is dramatically decreased. Film Assisted Molding (FAM) technology can meet the packaging demands of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS microsystems with low cost and excellent performance. Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adopted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window.