Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
Vertical Circuits, Inc Scotts Valley, CA, USA;
3D integration; edge interconnects; SIP; printed electronics;
机译:电流对具有Sn-Ag-Cu焊料互连的细间距球栅阵列封装的长期可靠性的影响
机译:等温老化对带有Sn-Ag-Cu焊料互连的细间距球栅阵列封装的长期可靠性的影响:芯片尺寸效应
机译:等温老化对带有Sn-Ag-Cu焊料互连的细间距球栅阵列封装的长期可靠性的影响:芯片尺寸效应
机译:包装解决方案中系统的细距3D可分配电互连
机译:一种超细间距倒装芯片互连封装的系统方法。
机译:用于实现高电导率和精细加工分辨率的聚(34-亚乙二醇噻吩)的新3D打印系统
机译:超细间距翻转夹封装的拉伸焊柱互连研究