Roadmap Differentiation and Emerging Trends in BCD Technology

摘要

This paper reviews the BCD technology roadmap and its evolution towards finer lithography features, wider voltage capability offer and the broadening variety of integrable components. The splitting of the roadmap into three main directions - high-voltage, high-power and high-density -and the different evolving criteria are discussed. The trend of more recent BCD versions to converge to technology platforms common to advanced CMOS processes, diversifying or simplifying the technology according to different application needs, the emerging and consolidation of new directions are presented. Examples of possible realizations in different application fields using the more suitable BCD approach are also proposed.