Research on interconnection test of SiP module

摘要

System in Package (SiP) plays an important role in Consumer Electronics, Military and Aerospace Electronics with the superiority of microminiaturization, weight reduction, high density, and high reliability. Nevertheless, SiP module test has encountered the problem on malfunction location with the system scale and system complexity exponentially increasing. An interconnect test detects, identifies and locates intra-die assembly defects, which is systematically performed in conventional board testing. Built on the JTAG test technology which has been responsibly used on board testing, this paper proposed a testing method, testing flow and testing platform for SiP module interconnection testing, and discussed the discrepancy between the testing for board and the testing for SiP. In the interconnection testing of the certain SiP module, the test coverage of the interconnection network is provided.