Customizable silicone materials for MEMS and semiconductor packages

摘要

Micro Electro Mechanical Systems (MEMS) are enabling the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector, which is driving MEMS growth, smartphones today can contain as many as ten to twelve - or even more - MEMS devices, with this number projected to grow in the coming years. Automotive integration of MEMS is also in the fast lane. Pressure sensors, speed sensors, air flow sensors, GPS systems and accelerometers - all are driven by MEMS and are critical elements to proper automobile function and efficiency. Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive's modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile has been developed. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique Silicone platform has been developed with the freedom to adjust not only the rheological properties, but other key material properties such as modulus as well. Different color samples can also be developed based on product requirements.