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Recent progress on development of sputtered PZT film at FUJIFILM

机译:FUJIFILM溅射PZT膜开发的最新进展

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FUJIFILM has developed a method of forming lead zirconate titanate (PZT) films with unusual piezoelectric properties using RF sputtering. The film has a piezoelectric coefficient of d= -250pm/V which is ~70% higher than conventional PZT film. This was made possible by high content of Nb dopant (13 at. %) and a precise control of crystal orientation. One of the most unique features of the film is observed in its polarization behavior. The film is spontaneously poled as being deposited, and the polarization is highly resistant to high temperatures. This unique feature of the film gives us great advantages during development of PZT film devices and building production lines.
机译:FUJIFILM已经开发出一种使用RF溅射形成具有异常压电特性的锆酸钛酸铅(PZT)膜的方法。该膜的压电系数为d = -250pm / V,比常规PZT膜高约70%。高含量的Nb掺杂剂(13 at。%)和精确的晶体取向控制使之成为可能。薄膜的最独特特征之一是其极化行为。薄膜在沉积时会自发极化,并且极化高度耐高温。薄膜的这一独特功能为我们在开发PZT薄膜设备和建筑生产线时提供了巨大的优势。

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