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Controlled pulse shape cooling in planar TAS-STT-MRAM for improved writeability

机译:平面TAS-STT-MRAM中受控的脉冲形状冷却以提高可写性

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In field written thermally assisted (TAS) MRAM, the storage layer is pinned with an antiferromag-netic layer. The writing of TAS-MRAM consists of heating the storage layer above the blocking temperature of the antiferromagnet using an injected current pulse through the tunnel barrier. This pulse can be used to assist the writing either combined to an external magnetic field or to a spin transfer torque (STT) [1] effect coming from the spin polarized current flow. After setting the storage layer direction during the write step, the current pulse is removed, pinning the storage layer in the set direction. The actual temperature decay occurs in a timescale of few tens of nanoseconds [2]. STT is efficient while the current is flowing through the junction but disappears during cooling, once the heating pulse is removed. This assumption is valid if the temperature gradients across the barrier, giving rise to spin accumulation of thermal origin are negligible. In these conditions, when the temperature is above or close to the blocking temperature of the antiferromagnetic layer pinning the storage layer, the written state might be thermally unstable. In this paper, we have investigated the possibility of controlling the temperature decay, so that the spin polarized current and temperature decay at the same rate. We show that there is an improvement in writing reproducibility using a linear transition at the end of the current pulse during the cooling phase. This is especially evident in cases where STT influence on the field writing is more significant. The write error rate dependence with the voltage transition duration was measured, and we find an optimum value for a 70ns transition, corresponding to a linear pulse amplitude decay of 18mVs.
机译:在现场写的热辅助(TAS)MRAM中,存储层固定有反铁磁层。 TAS-MRAM的写入包括使用通过隧道势垒的注入电流脉冲将存储层加热到反铁磁体的阻断温度以上。该脉冲可用于辅助写入,既可以结合到外部磁场,也可以结合来自自旋极化电流的自旋传递扭矩(STT)[1]效应。在写步骤中设置存储层方向后,将电流脉冲移除,将存储层固定在设置方向上。实际的温度衰减发生在几十纳秒的时间范围内[2]。当电流流过结时,STT效率很高,但是一旦移除加热脉冲,冷却过程中电流就会消失。如果跨越势垒的温度梯度(导致热源的自旋积累)可忽略不计,则此假设是有效的。在这些条件下,当温度高于或接近固定存储层的反铁磁层的阻断温度时,写入状态可能是热不稳定的。在本文中,我们研究了控制温度衰减的可能性,以使自旋极化电流和温度以相同的速率衰减。我们表明,在冷却阶段中,在电流脉冲结束时使用线性过渡可以改善写入再现性。这在STT对字段写入的影响更为显着的情况下尤其明显。测量了写入误差率随电压跃迁持续时间的依赖性,我们找到了一个70ns跃迁的最佳值,对应于18mV / ns的线性脉冲幅度衰减。

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