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KFM evaluation of seebeck coefficient in thin SOI layers

机译:SOI薄层中塞贝克系数的KFM评估

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Although the introduction of nanostructures into thermoelectric materials is one of key technology for enhancement in thermoelectric conversion efficiency, a technique for characterizing the nanometer-scale materials is required. With the aim of evaluating Seebeck coefficient of nanostructured thermoelectric materials, we propose a new technique by Kelvin- probe force microscopy (KFM) which gives us local surface potential corresponding to the Fermi energy difference of a sample relative to the cantilever. Hence, thermoelectromotive force and temperature difference are obtained from the surface potentials and temperatures at the high- and low-temperature regions on the sample, which leads to evaluation of Seebeck coefficient. First of all, the Seebeck coefficients of bulk Si wafers and Si-on-insulator (SOI) layers were measured. At present, the Seebeck coefficient is evaluated to be −2.8mV/K for a SOI layer, which is larger than the value obtained by a conventional method.
机译:尽管将纳米结构引入热电材料是提高热电转换效率的关键技术之一,但是仍需要用于表征纳米级材料的技术。为了评估纳米结构热电材料的塞贝克系数,我们提出了一种通过开尔文探针力显微镜(KFM)的新技术,该技术为我们提供了与样品相对于悬臂的费米能差相对应的局部表面电势。因此,从样品的高温区域和低温区域的表面电位和温度获得热电动势和温度差,这导致了塞贝克系数的评估。首先,测量块状硅晶片和绝缘体上硅(SOI)层的塞贝克系数。目前,对于SOI层,塞贝克系数被评估为-2.8mV / K,大于通过传统方法获得的值。

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