首页> 外文会议>2013 IEEE 31st International Conference on Computer Design >Program interference in MLC NAND flash memory: Characterization, modeling, and mitigation
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Program interference in MLC NAND flash memory: Characterization, modeling, and mitigation

机译:MLC NAND闪存中的程序干扰:表征,建模和缓解

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As NAND flash memory continues to scale down to smaller process technology nodes, its reliability and endurance are degrading. One important source of reduced reliability is the phenomenon of program interference: when a flash cell is programmed to a value, the programming operation affects the threshold voltage of not only that cell, but also the other cells surrounding it. This interference potentially causes a surrounding cell to move to a logical state (i.e., a threshold voltage range) that is different from its original state, leading to an error when the cell is read. Understanding, characterizing, and modeling of program interference, i.e., how much the threshold voltage of a cell shifts when another cell is programmed, can enable the design of mechanisms that can effectively and efficiently predict and/or tolerate such errors. In this paper, we provide the first experimental characterization of and a realistic model for program interference in modern MLC NAND flash memory. To this end, we utilize the read-retry mechanism present in some state-of-the-art 2Y-nm (i.e., 20–24nm) flash chips to measure the changes in threshold voltage distributions of cells when a particular cell is programmed. Our results show that the amount of program interference received by a cell depends on 1) the location of the programmed cells, 2) the order in which cells are programmed, and 3) the data values of the cell that is being programmed as well as the cells surrounding it. Based on our experimental characterization, we develop a new model that predicts the amount of program interference as a function of threshold voltage values and changes in neighboring cells. We devise and evaluate one application of this model that adjusts the read reference voltage to the predicted threshold voltage distribution with the goal of minimizing erroneous reads. Our analysis shows that this new technique can reduce the raw flash bit error rate by 64% and thereby improve flash lifetime by- 30%. We hope that the understanding and models developed in this paper lead to other error tolerance mechanisms for future flash memories.
机译:随着NAND闪存继续按比例缩小到较小的工艺技术节点,其可靠性和耐用性正在下降。降低可靠性的一个重要原因是编程干扰现象:将闪存单元编程为某个值时,编程操作不仅会影响该单元的阈值电压,还会影响其周围其他单元的阈值电压。这种干扰可能会导致周围的单元格移动到与其原始状态不同的逻辑状态(即阈值电压范围),从而导致在读取单元格时出现错误。理解,表征和建模程序干扰,即,当对另一个单元进行编程时一个单元的阈值电压偏移多少,可以实现能够有效和高效地预测和/或容忍这种错误的机制的设计。在本文中,我们为现代MLC NAND闪存中的程序干扰提供了第一个实验表征和现实模型。为此,我们利用某些先进的2Y-nm(即20-24nm)闪存芯片中存在的读取重试机制来测量特定单元编程时单元阈值电压分布的变化。我们的结果表明,一个单元接收到的程序干扰量取决于1)编程单元的位置,2)单元被编程的顺序以及3)被编程单元的数据值以及它周围的细胞。基于我们的实验特性,我们开发了一个新模型,该模型可根据阈值电压值和相邻单元中的变化来预测程序干扰的数量。我们设计并评估了该模型的一种应用,该应用将读取的参考电压调整为预测的阈值电压分布,以最大程度地减少错误的读取。我们的分析表明,这项新技术可以将原始闪存误码率降低64%,从而将闪存寿命提高30%。我们希望本文开发的理解和模型能够为未来的闪存带来其他容错机制。

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