首页> 外文会议>2012 IEEE 58th Holm Conference on Electrical Contacts. >Novel Helical Spring Contact for Low Force Fine Pitch Applications
【24h】

Novel Helical Spring Contact for Low Force Fine Pitch Applications

机译:适用于小力和小间距应用的新型螺旋弹簧触头

获取原文
获取原文并翻译 | 示例

摘要

The demand for increasing numbers of electrical contacts within the same connector footprint continues to drive contact pitches below 1mm and normal forces below 25 grams. The size reduction of contacts needed to keep pace with miniaturization is approaching the limits of traditional stamping and forming manufacturing processes. This work investigates the formation and properties of a novel spring contact produced from a pre-formed 51mm diameter wire. The resulting double helical contact springs provide a normal force of ~ 25 grams at a 0.25 mm compression, an elastic working range of 0.23mm, and stable electrical performance at ~ 5 grams force. Prototype sockets validated the functionality of the helical contacts in a fine pitch array, and demonstrated the potential for pitches down to 0.65 mm.
机译:在相同的连接器覆盖范围内增加电触点数量的需求继续将触点间距推向1mm以下,法向力降至25克以下。与小型化并驾齐驱所需的触头尺寸减小已接近传统冲压和成形制造工艺的极限。这项工作研究了由预成型的51mm直径金属丝制成的新型弹簧触点的形成和性能。最终的双螺旋接触弹簧在0.25 mm的压缩力下可提供〜25克的法向力,在0.25 mm的弹性工作范围内,在〜5克的力下具有稳定的电气性能。原型插座在细间距阵列中验证了螺旋形触点的功能,并展示了潜在的低至0.65 mm的间距。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号