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Structural and electrical characteristics of Al-doped TiO2 high-k gate dielectric grown by atomic layer deposition

机译:原子层沉积生长Al掺杂TiO2高k栅介质的结构和电学特性

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Al-doped TiO2 thin films grown on Si(100) by atomic layer deposition has been investigated as a potential high dielectric constant insulator in the application of microelectronics. The film thickness is determined by spectroscopy ellipsometry and transmission electron microscopy. X-ray photoelectron spectrometry is used to characterize the chemical composition and bonding states. The relative permittivity (k) determined by C-V measurement is 14.6. Moreover, ultralow hysteresis of C-V curves has been demonstrated for the Al-doped TiO2 film with few instable-trapped charges.
机译:已经研究了通过原子层沉积在Si(100)上生长的Al掺杂的TiO 2 薄膜作为微电子应用中潜在的高介电常数绝缘体。膜厚通过光谱椭圆偏振法和透射电子显微镜确定。 X射线光电子能谱法用于表征化学组成和键合状态。通过C-V测量确定的相对介电常数(k)为14.6。此外,已经证明了掺铝量很少的俘获电荷的掺铝TiO 2 薄膜具有超低的C-V曲线滞后。

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