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Effect of polysilicon gate doping concentration variation on MOSFET characteristics

机译:多晶硅栅极掺杂浓度变化对MOSFET特性的影响

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Polysilicon gates have replaced the metal gates in CMOS technology. If the doping is not high enough in polysilicon then the flatband voltage should be corrected. Polysilicon gates are also depleted with the application of gate voltage. The dependence of MOSFET current (Ids) on polysilicon gate concentration is studied using the results simulated by Sentaurus TCAD tool in case of N channel MOSFETs. With the decrease in polysilicon gate doping concentration (Nd), the drain current is more degraded. A theory is developed, in order to explain the simulation results that take into consideration the correction in flatband voltage and the voltage drop due to polysilicon depletion. From the analysis of simulated and theoretical curves, an inversion region is suspected to occur at the polysilicon gate for low doping concentration at high gate voltage.
机译:多晶硅栅极已经取代了CMOS技术中的金属栅极。如果多晶硅中的掺杂不够高,则应校正平带电压。随着栅极电压的施加,多晶硅栅极也被耗尽。在N沟道MOSFET的情况下,使用Sentaurus TCAD工具模拟的结果研究了MOSFET电流(I ds )对多晶硅栅极浓度的依赖性。随着多晶硅栅极掺杂浓度(N d )的降低,漏极电流进一步降低。为了解释仿真结果,开发了一种理论,该仿真结果考虑了平带电压的校正和多晶硅耗尽引起的电压降。从模拟和理论曲线的分析来看,在高栅极电压下低掺杂浓度的多晶硅栅极上可能会出现反转区。

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