Optimization of geometrical parameters of optical interconnect module based on double side perforated silicon optical platform for high coupling efficiency

摘要

We demonstrated a new structure of optical interconnect module based on double side perforated silicon optical platform. This structure can eliminate the use of micro mirrors, lens, and guide pin, leading to a reduced packaging cost and volume. Simulation results show that the proposed structure can result in high coupling efficiency with relaxed permissible error for assembly.