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Investigation of crosstalk impact on channel performance from IC package and motherboard breakout routing

机译:研究IC封装和母板突破布线对串扰对通道性能的影响

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Crosstalk is one of the signal integrity (SI) issues which is critical especially in systems with high operating speed and high circuit density. In this paper, the impact of crosstalk on channel performance is investigated based on the IC package and motherboard breakout routing. Differential pair spacing and coupling length were manipulated for the IC package breakout routing and motherboard breakout routing respectively. First, the crosstalk behavior on the breakout routing models are investigated in frequency and time domain. Next, the breakout routing models are used in the channel analysis, along with other components that form a channel. The crosstalk impact towards the channel is presented in terms of eye diagram parameters. Some conclusions are presented and can be used as a guideline for future circuit designers.
机译:串扰是信号完整性(SI)问题之一,尤其在具有高工作速度和高电路密度的系统中,这一问题至关重要。本文基于IC封装和母板分支布线,研究了串扰对通道性能的影响。分别针对IC封装的突破布线和主板突破布线对差分对间距和耦合长度进行了控制。首先,在频域和时域研究了突破路由模型上的串扰行为。接下来,在通道分析中使用突破路由模型以及构成通道的其他组件。用眼图参数表示对通道的串扰影响。提出了一些结论,可以作为未来电路设计人员的指南。

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