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The electrical conductivity of copper (I) iodide (CuI) thin films prepared by mister atomizer

机译:喷雾器雾化制备的碘化铜(I)薄膜的电导率

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In this paper, the copper (I) iodide (CuI) thin films were prepared by mister atomizer with different thickness. The effect of thickness of CuI thin films were done by varying the deposition flow rate and deposition time. The effects of thickness to its structural, electrical and optical properties were studied. The resistivity increases as the thickness of thin film increase with highest resistivity of 4.79 × 101 Ω cm. The transmittance for most of the samples was transparent of above 80% in the visible wavelength. The transmittance and absorption coefficient was measured and then the energy gap was determined which shows the direct transition of n=2. The maximum band gap observed here is 2.82 eV for the thickest thin films. The observation on effect of thickness in this study shows that the increasing of thin film thickness increased the resistivity while the absorption coefficient decrease with slight rise of band gap which due to the bulk grain properties for thick thin film.
机译:本文采用不同厚度的雾化雾化器制备了碘化铜(I)铜薄膜。通过改变沉积流速和沉积时间来完成CuI薄膜厚度的影响。研究了厚度对其结构,电学和光学性质的影响。电阻率随着薄膜厚度的增加而增加,最高电阻率为4.79×10 1 Ωcm。在可见光波长下,大多数样品的透射率是透明的,超过80%。测量透射率和吸收系数,然后确定能隙,其显示n = 2的直接跃迁。对于最厚的薄膜,此处观察到的最大带隙为2.82 eV。在这项研究中对厚度影响的观察表明,薄膜厚度的增加会增加电阻率,而吸收系数会随着带隙的增加而降低,这归因于厚薄膜的整体晶粒特性。

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