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High-Voltage LDMOS Compact Modelling

机译:高压LDMOS紧凑建模

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In compact modelling of high-voltage LDMOS devices often a sub-circuit approach is used. While for the channel region a standard compact MOS model (for example BSIM4, MM11 or PSP) is used, the drift region is described by a compact JFET model. We will show that using this conventional approach the effects of the widening of the depletion region in the lateral direction cannot be taken into account properly. As a consequence the voltage at the internal node between channel and drift region becomes unphysical and accurate physics-based capacitance modelling becomes unfeasible.rnIn this paper we will introduce a new approach for compact LDMOS modelling to remedy these shortcomings. Next this new approach is compared with device simulations and measurements for both currents and capacitances. Finally we describe the method to implement this approach in a circuit simulator.
机译:在高压LDMOS器件的紧凑建模中,通常使用子电路方法。对于通道区域,使用标准的紧凑型MOS模型(例如BSIM4,MM11或PSP),而漂移区域由紧凑型JFET模型描述。我们将显示,使用这种常规方法无法正确考虑横向上耗尽区扩大的影响。结果,沟道和漂移区之间的内部节点处的电压变得不物理,并且基于物理的精确电容建模变得不可行。在本文中,我们将介绍一种用于紧凑型LDMOS建模的新方法,以弥补这些缺点。接下来,将该新方法与器件仿真和电流和电容测量进行比较。最后,我们描述了在电路仿真器中实现此方法的方法。

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