Defect sensitivity and strength of paperboard in out-of-plane tension and shear

摘要

This paper considers the effects of damage on the stress and strain properties in the thickness direction of multilayered board. Built-in defects are cut parallel to the MD-CD plane. The main issue is to study how the peak stress value changes in samples with different crack lengths under different load conditions. The specimens are glued on the Arcan device and tested under pure tensile stress and mixed shear-tensile stress. The decrease of the peak tensile stress measured in damaged samples proves the defects sensibility of multilayered board. The loss in tensile strength is independent of the crack length. On the other hand mixed shear and tensile stress behaviour does not appear to be influenced by the presence of defects.