SIX SIGMA METHOD APPLIED FOR REFLOW SOLDERING PROCESS IN SMT (SURFACE MOUNT TECHNOLOGY)

摘要

The Six Sigma method using a DMAIC methodology is being applied for analyzing the reflow process in an SMT assembly line. The Define Phase (D) and Measure Phase (M) were concluded and the Analysis Phase (A) is under way. Defects generated in the reflow soldering process were measured and classified. It was found that most of the defects observed in our assembly line are actually generated inside the reflow oven, indicating that the oven is contaminated. It was found that even solder spots, which would be more reasonable to be associated to the stencil printing step, are generated inside the reflow oven.