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MILITARY AVIONICS TWENTY YEARS IN THE FUTURE

机译:未来二十年的军用航空学

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This paper explores the generic structure of avionics beyond the Pave Pace system architecture. Projected constraints, opportunities and trends in several pervasive system building blocks which should be mature by this time frame are discussed and an example of the form this architecture might take is offered. In developing these projections, the author interviewed several technology experts in Industry and Government to help in forecasting the future of military avionics. General conclusions are: (1) cost-driven sensor solutions will drive the avionics designs for most military avionics applications in order to meet demanding situation awareness goals, (2) the most pervasive and highest-leveraged building blocks used to build this advanced system will be commercially-available data and signal processors along with advanced A/D converters and digital and RF photonics, (3) a continued increase in time sharing and physical integration at every level of the avionics architecture is projected, including multifunction EO and RF apertures, RF support electronics and a highly integrated digital system, (4) distributed high-speed photonic switches will permeate the architecture to achieve a unified interconnect network across RF, IF, data and signal processing modules built from families of printed wiring boards, (5) advances in packaging and microelectronics will result in the need for liquid immersion cooling and 3-dimensional stacking of RF, digital and photonic circuitry to support integrated apertures, digital receivers and data and signal processors to accomodate the needed speed and functional integration, (6) the digital boundary will move closer to the apertures to enable IF digital receivers for electronic warfare and radar applications (digital receivers up through L-band will have occurred during the Pave Pace era) and will extend the use of photonics beyond the digital arena to where photonically-controlled beam steering for phased arrays, RF signal distribution and hetereodyning will be possible.
机译:本文探讨了Pave Pace系统架构以外的航空电子的通用结构。讨论了在这个时间框架内应该成熟的几个普遍的系统构建块中的预期约束,机会和趋势,并提供了此体系结构可能采用的形式的示例。在制定这些预测时,作者采访了工业界和政府的几位技术专家,以帮助预测军事航空电子的未来。总体结论是:(1)成本驱动型传感器解决方案将推动大多数军用航空电子应用的航空电子设计,以满足苛刻的态势感知目标;(2)用于构建此先进系统的最普及,使用最多的构件(3)预计将在航空电子体系结构的各个级别(包括多功能EO和RF孔径)不断增加时间共享和物理集成,成为可商用的数据和信号处理器以及先进的A / D转换器以及数字和RF光子学;射频支持电子设备和高度集成的数字系统,(4)分布式高速光子开关将渗透到该架构中,以实现跨由印刷线路板系列构建的RF,IF,数据和信号处理模块的统一互连网络,(5)包装和微电子技术的进步将导致需要液浸冷却和RF,数字和照片的3维堆叠支持集成光圈,数字接收器以及数据和信号处理器的nic电路,以适应所需的速度和功能集成。(6)数字边界将更靠近光圈,从而使IF数字接收器可用于电子战和雷达应用(数字接收器向上L波段将发生在Pave Pace时代),并将把光子学的应用范围扩展到数字领域以外,从而实现相控阵的光子控制光束控制,RF信号分配和异质分析。

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