Thin Wafer Pre-Align Gripping System -A New Mechatronic Approach to Semiconductor Handling

摘要

This paper describes a new mechatronic approach to thin wafer handling and pre-aligning issues in semiconductor fabrication. Thin wafers are less than 200μm thick and require specified handling solutions. One solution is the Bernoulli-Vacuum combined grip principle, which successfully treats wafers with significant warpage up to 10 mm. A mechatronic gripper, which can replace standard pre-aligners by incorporating the functionality into the gripper and decreases cycle times is discussed. The mechatronic design and the control algorithms are explained in detail. Test results show that the accuracy at the system is 100 μm and the repeatability is 50 μm.